Winbond Electronics W66BP6NBQAGJ

Part No.:
W66BP6NBQAGJ
Manufacturer:
Winbond Electronics
Category:
Memory
Package:
200-TFBGA
Datasheet:
IC-MAX.COMW66BP6NBQAGJ.pdf
Description:
IC DRAM 2GBIT LVSTL 11 200TFBGA
Quantity:

Unit Price:$0

Ext Price:$0

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W66BP6NBQAGJ Information

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Product attributes
Attribute value
Manufacturer:
Winbond Electronics
Series:
-
Package/Case:
200-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
-
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - Mobile LPDDR4
Memory Size:
2Gbit
Memory Organization:
128M x 16
Memory Interface:
LVSTL_11
Clock Frequency:
1.867 GHz
Write Cycle Time - Word, Page:
18ns
Access Time:
3.6 ns
Voltage - Supply:
1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
200-TFBGA (10x14.5)
Datasheet:
IC-MAX.COMW66BP6NBQAGJ.pdf
Image W66BP6NBQAGJ TR W66BP6NBQAGJ
Part Number W66BP6NBQAGJ TR W66BP6NBQAGJ
Manufacturer Winbond Electronics Winbond Electronics
Series - -
Package/Case 200-TFBGA 200-TFBGA
Packaging Tape & Reel (TR) Tray
Product Status Active Active
Programmable - -
Memory Type Volatile Volatile
Memory Format DRAM DRAM
Technology SDRAM - Mobile LPDDR4 SDRAM - Mobile LPDDR4
Memory Size 2Gbit 2Gbit
Memory Organization 128M x 16 128M x 16
Memory Interface LVSTL_11 LVSTL_11
Clock Frequency 1.867 GHz 1.867 GHz
Write Cycle Time - Word, Page 18ns 18ns
Access Time 3.6 ns 3.6 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC) -40°C ~ 105°C (TC)
Grade - -
Qualification - -
Mounting Type Surface Mount Surface Mount
Supplier Device Package 200-TFBGA (10x14.5) 200-TFBGA (10x14.5)
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Step1:Prepare product
Step1:Prepare product
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Step2:Vacuum packaging
Step3:Anti-static bag
Step3:Anti-static bag
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Step4:Individual package
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Step5:Packaging box
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Step6:Barcode shipping label
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