Texas Instruments TDA3MDDBABFQ1
- Part No.:
- TDA3MDDBABFQ1
- Manufacturer:
- Texas Instruments
- Category:
- System On Chip (SoC)
- Package:
- 367-BFBGA, FCBGA
- Description:
- LOW POWER SOC W/ FULL-FEATURED P
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
TDA3MDDBABFQ1 Information
- Specifications
- Product Details
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 367-BFBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Architecture:
- DSP, MPU
- Core Processor:
- ARM® Cortex®-M4, C66x
- Flash Size:
- -
- RAM Size:
- 512kB
- Peripherals:
- DMA, POR, PWM, WDT
- Connectivity:
- CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
- Speed:
- 212.8MHz, 500MHz
- Primary Attributes:
- -
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 367-FCBGA (15x15)
| Image |  |
| Part Number | TDA3MDDBABFQ1 |
| Manufacturer | Texas Instruments |
| Series | - |
| Package/Case | 367-BFBGA, FCBGA |
| Packaging | Tape & Reel (TR) |
| Product Status | Active |
| Architecture | DSP, MPU |
| Core Processor | ARM® Cortex®-M4, C66x |
| Flash Size | - |
| RAM Size | 512kB |
| Peripherals | DMA, POR, PWM, WDT |
| Connectivity | CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB |
| Speed | 212.8MHz, 500MHz |
| Primary Attributes | - |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Grade | - |
| Qualification | - |
| Supplier Device Package | 367-FCBGA (15x15) |
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