Texas Instruments DRA829JMTGBALFR

Part No.:
DRA829JMTGBALFR
Manufacturer:
Texas Instruments
Category:
System On Chip (SoC)
Package:
827-BFBGA, FCBGA
Datasheet:
IC-MAX.COMDRA829JMTGBALFR.pdf
Description:
DUAL ARM CORTEX-A72, QUAD CORTEX
Quantity:

Unit Price:$0

Ext Price:$0

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DRA829JMTGBALFR Information

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Manufacturer:
Texas Instruments
Series:
-
Package/Case:
827-BFBGA, FCBGA
Packaging:
Tape & Reel (TR)
Product Status:
Last Time Buy
Architecture:
DSP, MCU, MPU
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Flash Size:
-
RAM Size:
1.5MB
Peripherals:
DMA, PWM, WDT
Connectivity:
I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Speed:
2GHz, 1GHz, 1.35GHz, 1GHz
Primary Attributes:
-
Operating Temperature:
-40°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
827-FCBGA (24x24)
Datasheet:
IC-MAX.COMDRA829JMTGBALFR.pdf
Image DRA829JMTGBALFR DRA829JMTGBALFRQ1
Part Number DRA829JMTGBALFR DRA829JMTGBALFRQ1
Manufacturer Texas Instruments Texas Instruments
Series - -
Package/Case 827-BFBGA, FCBGA 827-BFBGA, FCBGA
Packaging Tape & Reel (TR) Tape & Reel (TR)
Product Status Last Time Buy Last Time Buy
Architecture DSP, MCU, MPU DSP, MCU, MPU
Core Processor ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Flash Size - -
RAM Size 1.5MB 1.5MB
Peripherals DMA, PWM, WDT DMA, PWM, WDT
Connectivity I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Speed 2GHz, 1GHz, 1.35GHz, 1GHz 2GHz, 1GHz, 1.35GHz, 1GHz
Primary Attributes - -
Operating Temperature -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ)
Grade - -
Qualification - -
Supplier Device Package 827-FCBGA (24x24) 827-FCBGA (24x24)
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