Microchip Technology TSXPC860SRVZQU66D

Part No.:
TSXPC860SRVZQU66D
Manufacturer:
Microchip Technology
Category:
Microprocessors
Package:
357-BBGA
Datasheet:
IC-MAX.COMTSXPC860SRVZQU66D.pdf
Description:
IC MPU 66MHZ 357BGA
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
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TSXPC860SRVZQU66D Information

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Manufacturer:
Microchip Technology
Package/Case:
357-BBGA
Series:
-
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100Mbps (1)
SATA:
-
USB:
-
Voltage - I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
357-PBGA (25x25)
Additional Interfaces:
I2C, PCMCIA, SCC, SMC, SPI, UART
Datasheet:
IC-MAX.COMTSXPC860SRVZQU66D.pdf
Image TSXPC860SRVZQU66D
Part Number TSXPC860SRVZQU66D
Manufacturer Microchip Technology
Package/Case 357-BBGA
Series -
Packaging Tray
Product Status Obsolete
Core Processor PowerPC
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 66MHz
Co-Processors/DSP Communications; CPM
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100Mbps (1)
SATA -
USB -
Voltage - I/O 3.3V
Operating Temperature -40°C ~ 110°C (TC)
Grade -
Qualification -
Security Features -
Mounting Type Surface Mount
Supplier Device Package 357-PBGA (25x25)
Additional Interfaces I2C, PCMCIA, SCC, SMC, SPI, UART
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Step1:Prepare product
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FedEx International, 5-7 business days.

The following are some common countries' logistic time.

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