Infineon Technologies CYT3DLABHBQ1AESGST

Part No.:
CYT3DLABHBQ1AESGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
216-LQFP Exposed Pad
Datasheet:
IC-MAX.COMCYT3DLABHBQ1AESGST.pdf
Description:
TRAVEO-2 CLUST.2.5DGRAPH
Quantity:

Unit Price:$0

Ext Price:$0

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CYT3DLABHBQ1AESGST Information

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Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
216-LQFP Exposed Pad
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 240MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
108
Program Memory Size:
4.06MB (4.06M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 48x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Datasheet:
IC-MAX.COMCYT3DLABHBQ1AESGST.pdf
Image CYT3DLABHBQ1AESGST
Part Number CYT3DLABHBQ1AESGST
Manufacturer Infineon Technologies
Package/Case 216-LQFP Exposed Pad
Series Traveo™ T2G
Packaging Tape & Reel (TR)
Product Status Active
Programmable -
Core Processor ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size 32-Bit Dual-Core
Speed 100MHz, 240MHz
Connectivity CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O 108
Program Memory Size 4.06MB (4.06M x 8)
Program Memory Type FLASH
EEPROM Size 128K x 8
RAM Size 384K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 48x12b SAR
Oscillator Type External, Internal
Operating Temperature -40°C ~ 105°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Supplier Device Package
  • CYT3DLABHBQ1AESGST
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