Trenz Electronic GmbH TE0630-01IV

Part No.:
TE0630-01IV
Manufacturer:
Trenz Electronic GmbH
Category:
Microcontrollers, Microprocessor, FPGA Modules
Package:
Datasheet:
IC-MAX.COMTE0630-01IV.pdf
Description:
IC MODULE LX150 100MHZ 128MB
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Unit Price:$0

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TE0630-01IV Information

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Manufacturer:
Trenz Electronic GmbH
Series:
TE0630
Packaging:
Bulk
Product Status:
Discontinued at Digi-Key
Module/Board Type:
FPGA, USB Core
Core Processor:
Spartan-6 LX-150
Co-Processor:
Cypress EZ-USB FX2LP
Speed:
100MHz
Flash Size:
8MB
RAM Size:
128MB
Connector Type:
B2B
Size / Dimension:
1.600" L x 1.900" W (40.50mm x 47.50mm)
Operating Temperature:
-40°C ~ 85°C
Datasheet:
IC-MAX.COMTE0630-01IV.pdf
Image TE0630-03-63I12-A TE0630-03-52I12-A TE0630-02I TE0630-03-52I22-A TE0630-02IBF
Part Number TE0630-03-63I12-A TE0630-03-52I12-A TE0630-02I TE0630-03-52I22-A TE0630-02IBF
Manufacturer Trenz Electronic GmbH Trenz Electronic GmbH Trenz Electronic GmbH Trenz Electronic GmbH Trenz Electronic GmbH
Series Spartan Spartan TE0630 - TE0630
Packaging Bulk Bulk Bulk Bulk Bulk
Product Status Active Active Obsolete Active Obsolete
Module/Board Type FPGA FPGA FPGA, USB Core - FPGA, USB Core
Core Processor Xilinx Spartan™ 6 XC6SLX75-3CSG484I Xilinx Spartan™ 6 XC6SLX45-2CSG484I Spartan-6 LX-45 - Spartan-6 LX-75
Co-Processor - - Cypress EZ-USB FX2LP - Cypress EZ-USB FX2LP
Speed - - 100MHz - 100MHz
Flash Size 8MB 8MB 8MB - 8MB
RAM Size 128MB 128MB 128MB - 128MB
Connector Type Board-to-Board (BTB) Socket - 80 Board-to-Board (BTB) Socket - 80 B2B - B2B
Size / Dimension 1.970" L x 1.570" W (50.00mm x 40.00mm) 1.970" L x 1.570" W (50.00mm x 40.00mm) 1.600" L x 1.900" W (40.50mm x 47.50mm) - 1.600" L x 1.900" W (40.50mm x 47.50mm)
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C - -40°C ~ 85°C
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