AMD XCZU4CG-L1FBVB900I
- Part No.:
- XCZU4CG-L1FBVB900I
- Manufacturer:
- AMD
- Category:
- System On Chip (SoC)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCZU4CG-L1FBVB900I.pdf
- Description:
- IC SOC CORTEX-A53 900FCBGA
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
XCZU4CG-L1FBVB900I Information
- Specifications
- Product Details
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Zynq® UltraScale+™ MPSoC CG
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Architecture:
- MCU, FPGA
- Core Processor:
- Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size:
- -
- RAM Size:
- 256KB
- Peripherals:
- DMA, WDT
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed:
- 500MHz, 1.2GHz
- Primary Attributes:
- Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
- Datasheet:
-
XCZU4CG-L1FBVB900I.pdf
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| Part Number | XCZU4CG-1SFVC784I | XCZU4CG-2SFVC784I | XCZU4CG-1FBVB900E | XCZU4CG-1SFVC784E | XCZU4CG-2SFVC784E |
| Manufacturer | AMD | AMD | AMD | AMD | AMD |
| Series | Zynq® UltraScale+™ MPSoC CG | Zynq® UltraScale+™ MPSoC CG | Zynq® UltraScale+™ MPSoC CG | Zynq® UltraScale+™ MPSoC CG | Zynq® UltraScale+™ MPSoC CG |
| Package/Case | 784-BFBGA, FCBGA | 784-BFBGA, FCBGA | 900-BBGA, FCBGA | 784-BFBGA, FCBGA | 784-BFBGA, FCBGA |
| Packaging | Tray | Tray | Tray | Tray | Tray |
| Product Status | Active | Active | Active | Active | Active |
| Architecture | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - | - | - | - | - |
| RAM Size | 256KB | 256KB | 256KB | 256KB | 256KB |
| Peripherals | DMA, WDT | DMA, WDT | DMA, WDT | DMA, WDT | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz | 533MHz, 1.3GHz | 500MHz, 1.2GHz | 500MHz, 1.2GHz | 533MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
| Grade | - | - | - | - | - |
| Qualification | - | - | - | - | - |
| Supplier Device Package | 784-FCBGA (23x23) | 784-FCBGA (23x23) | 900-FCBGA (31x31) | 784-FCBGA (23x23) | 784-FCBGA (23x23) |
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