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Modems - ICs and Modules

制造商	Series	Package/Case	Packaging	Product Status	Data Format	Baud Rates	Voltage - Supply	Mounting Type	Supplier Device Package
Analog Devices Inc. Analog Devices Inc./Maxim Integrated CML Micro Conexant Copeland Communications Inc. Cypress Semiconductor Corp Freescale Semiconductor - NXP Harris Corporation Infineon Technologies Intel IXYS Integrated Circuits Division Lantiq MaxLinear, Inc. Microchip Technology Motorola NXP Semiconductors onsemi Rochester Electronics, LLC Semtech Corporation Silicon Labs Skyworks Solutions Inc. SMSC STMicroelectronics Texas Instruments Wintec Industries Yamar Zarlink Zilog	* - 89024 AD1801 CY8CPLC10 ISOcap™ ISOmodem® ISOmodem™ SL SLM	- 100-TQFP 120-LQFP 128-BFQFP 128-LQFP 128-QFP 16-DIP (0.300", 7.62mm) 16-SOIC (0.154", 3.90mm Width) 16-SOIC (0.295", 7.50mm Width) 16-TSSOP (0.173", 4.40mm Width) 16-VFQFN Exposed Pad 20-SOIC (0.295", 7.50mm Width) 20-TSSOP (0.173", 4.40mm Width) 22-DIP (0.400", 10.16mm) 24-SOIC (0.295", 7.50mm Width) 24-SSOP (0.209", 5.30mm Width) 24-TSSOP (0.173", 4.40mm Width) 24-VFQFN Exposed Pad 24-WFQFN Exposed Pad, CSP 28-DIP (0.600", 15.24mm) 28-LCC (J-Lead) 28-SOIC (0.295", 7.50mm Width) 28-SSOP (0.209", 5.30mm Width) 28-VFCLGA 28-VFQFN Exposed Pad 32-LCC (J-Lead) 32-LQFP 32-TQFP 32-VFQFN Exposed Pad 38-VFQFN Exposed Pad 40-DIP Module 44-LCC (J-Lead) 44-LQFP 48-LQFP 48-VFQFN Exposed Pad 52-VFQFN Exposed Pad 56-VFQFN Exposed Pad 64-LQFP 64-VFQFN Exposed Pad 68-LCC (J-Lead) 8-SOIC (0.154", 3.90mm Width) Exposed Pad Module	Box Bulk Cut Tape (CT) Strip Tape & Reel (TR) Tray Tube	Active Discontinued at Digi-Key Last Time Buy Not For New Designs Obsolete	- ASK ASK over Home Power Lines FSK FSK, Bell 202 FSK, V.21, V.22, Bell 103, Bell 212A FSK, V.21, V.22, V.23, Bell 103, Bell 212A FSK, V.23 HART PSK V.21, V.22, Bell 103, Bell 212A V.21, V.22, V.22B, V.23, V.32, V.32B, V.34, V.90, Bell 103, Bell 212 V.21, V.22, V.23, Bell 103, Bell 202, FSK V.21, V.22, V.23, Bell 103, Bell 212A V.21, V.22, V.23, V.29, Bell 103, Bell 212A V.21, V.22, V.23, V.29, V.32, Bell 103, Bell 212A V.21, V.22, V.23, V.29, V.32, V.34, Bell 103, Bell 212A V.21, V.22, V.23, V.29, V.32, V.34, V.90, V.92, Bell 103, Bell 212A V.21, V.22, V.23, V.32, Bell 103, Bell 202, FSK V.21, V.22, V.23, V.32, V.34, V.90, Bell 103, Bell 212A V.21, V.23, Bell 103, Bell 202, FSK V.22 V.22, V.23 V.22, V23, V.32, V.34, V.90, Bell 103, Bell 212A V.22, V23, V.32, V.34, V.90, V.92, Bell 103, Bell 212A V.32 V.32, V.34, V.90 V.32, V.34, V.90, V.92 V.34 V.34, V.92 V.90 V.92	- 1.2k 1.2k, 1.8k 1.8k 14.4k 19.2k 2.4k 200k 20k 225k ~ 1.4M 300 ~ 9.6k 33.6k 38.4k 4.8k 56k 83.3k ~ 1M 9.6k 9.6k ~ 115.2k Selectable	- 1.42V ~ 1.65V 1.71V ~ 5.5V 1.7V ~ 1.9V, 3V ~ 3.6V 1.8V ~ 3.5V 12V 2.7V ~ 3.6V 2.7V ~ 5.5V 3.3V 3.3V ~ 5V 3.3V, 5V 3V ~ 12V 3V ~ 3.6V 3V ~ 5.25V 3V ~ 5.5V 3V ~ 5V 4.5V ~ 5.5V 4.75V ~ 5.25V 4V ~ 5.5V 5V	- Socket Surface Mount Through Hole	- 100-LQFP 100-TQFP 120-LQFP (14x14) 128-LFQFP 128-LQFP (20x14) 128-MQFP (14x20) 128-TQFP (14x20) 16-PDIP 16-SO 16-SOIC 16-TSSOP 16-VQFN (3x3) 18-DIP 20-SOIC 20-TSSOP 22-PDIP 24-LFCSP-WQ (4x4) 24-QFN (4x4) 24-SOIC 24-SSOP 24-TSSOP 28-CTLGA (11x6.4) 28-PDIP 28-PLCC (11.51x11.51) 28-QFN (6x6) 28-SOIC 28-SOP 28-SSOP 32-LQFP (7x7) 32-PLCC (14x11.46) 32-QFN (5x5) 32-TQFP 32-TQFP (7x7) 38-QFN (5x7) 44-LQFP (10x10) 44-PLCC 48-LQFP (7x7) 48-QFN (7x7) 48-VQFN (7x7) 52-QFN (8x8) 56-QFN (8x8) 64-LQFP (10x10) 64-VQFN (9x9) 68-PLCC 8-SOIC-EP Module

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结果:

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Data Format Baud Rates Voltage - Supply Mounting Type Supplier Device Package

CD22212E1

CD22212E1

SINGLE-CHIP 1200BPS MODEM

Harris Corporation

770

-

RFQ

-

22-DIP (0.400", 10.16mm)

Bulk

Active

FSK

-

12V

Through Hole

22-PDIP

CD22212E

CD22212E

SINGLE-CHIP 1200BPS MODEM

Harris Corporation

440

-

RFQ

-

28-DIP (0.600", 15.24mm)

Bulk

Active

FSK

-

12V

Through Hole

28-PDIP

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